Wlbt waferlevel burnin and test helps to simplify the final manufacturing process and to reduce overall product cost. Distributed test wafer probe, insitu test between key assembly steps and final test slt and ate for 2. Our technology enables customers to utilize sub30v power and device control to actively test and burnin a v device at waferlevel burnin where thousands of devices are tested in parallel. The custom photodiode test system is a scalable system that provides a low cost, high performance, accelerated aging, burn in, and qualification testing for photodiodes specifically used in military, telecommunication, and aerospace applications. Move it closer to the source of the problem do it cheaper maybe full wafer bi and test. Aehr test systems to introduce next generation foxxp test.
It is a key enabler for achieving costeffective implementation of systeminpackage solutions, said gans ganesan, packaging technology manager for motorolas networking and computing systems group. Test during burnin is a hot topic evaluation engineering. Aehr test systems is a worldwide provider of test systems for burnin test equipment and logic, optical and memory integrated circuits worldwide. Burnin is a temperaturebias reliability stress test used in detecting and screening out potential early life failures. This type of testing applies a high level of stress to special test structures on the wafer and measures the degradation caused by this stress.
It is a key enabler for achieving costeffective implementation of systeminpackage solutions, said gans ganesan, packaging technology manager. Wafer level stress data successfully used as early burnin predictor. It effectively traps the loose debris which accumulates on the probe tip and shaft during waferlevel test. Stress all devices with enhanced test capability multisite testing at the wafer level for efficient throughput tests at high temperature high temperature capability and materials chuck, prober, probe card with stiffener challenges. Pdf wafer level stress data successfully used as early burn. Within a wafer lot, occasionally an individual wafer will differ significantly from the yield of all the other wafers. Aehr test systems to participate in two upcoming investor. Form today announced the introduction of the latest addition to its harmonytm family of fullarea, 300mm wafer probe solutionsthe harmony waferlevel burnin wlbi probe card.
The wlr paradigm offers several advantages over a sample burnin process monitor. Mpi integration of celadon systems high performance probe cards inside mpi automated probe systems like ts2000se or ts3000se, makes the high density, multisite, high temperature wafer level reliability testing easy and versatile. For more information on these and other solutions from kes, please fill out our contact form and we will respond as quickly as possible. A fullyautomated, 48pin parametric test system is designed for wafer level testing of power semiconductor devices and structures up to 3kv. Not only does wafer level burnin and test offer an opportunity to experience significant cost and throughput benefits, but it is required as an enabling technology if we are going to be successful in offering module and systeminpackage solutions to our customers, said kelly folts, product engineering and program manager with motorola. Wafer level reliability wafer level reliability testing. Passmark burnintest software pc reliability and load testing. Techniques for performing wafer level burn in and test of semiconductor devices include a test substrate having active electronic components such as asics mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the asics and a plurality of devicesunder test duts on a wafer under test wut, all disposed in a vacuum.
While our motivation is to achieve improvements over burnin of packaged parts, waferlevel burnin will actually allow us to create a manufacturing process thats much. Consumers are demanding higher capability portable electronic devices ranging from cellular telephones with built in cameras to pdas that are. Wlbi driving factors cost reduction burn in was viewed as temporary well only bi until the new process is stable when it became stable, another new process. Wafer level stress data successfully used as early burnin. This type of testing applies a high level of stress to special test structures on the wafer. Waferlevel burnin microchips triple test flow is currently the most robust testing procedure for serial eeprom devices in. These automated test solutions provide high volume, automated systemlevel testing and thermal testing, making it easy and affordable to conduct 100% slt. Gelsinger said, were already burning in devices in expensive chambers, and by using dft techniques, we can actually bring a great deal of the testing into the burnin process. Burnin is a temperaturebias reliability stress test used in detecting and screening out potential early life device failures. Waferlevel burnin will cut motorola costs ee times. Systemlevel testing for semiconductor devices youtube. Rji technical sales your source for wafer level bi and test.
For windows also available for linux stress test all the major subsystems of a computer for endurance, reliability and stability. At the core of the test system is stis proprietary drive sense technology dst. Waferlevel burnin and test wlbt is a method for burningin devices while they are still unpackaged. Optimized for use with the latest compound power semiconductor materials including silicon carbide sic and gallium nitride gan, the fully integrated keithley s540 power semiconductor test system is said to perform all highvoltage, lowvoltage, and. Waferlevel burnin with test solid state technology. Sti3000 wafer probe test system solidus technologies, inc.
Learn how the ats 5034 systemlevel test platform tests integrated semiconductors at 5,000 uph to deliver improved yields and the lowest cost of test. Techniques for performing waferlevel burnin and test of semiconductor devices include a test substrate having active electronic components such as asics mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the asics and a plurality of devicesundertest duts on a waferundertest wut, all disposed in a vacuum. Waferlevel test and burnin refers to the process of subjecting semiconductor devices to electrical testing and burnin while they are still in. Wlr testing is a statistical process control tool that gathers data through. Dvi worked with a major semiconductor manufacturer developing a unique wafer level burn in system technology. Test during burnin at the waferlevel enhances the bene. Waferlevel testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. The solution adopts the dualcore hardware topology and a threelevel. Wlr testing is a statistical process control tool that gathers data through parametric testing to identify process anomalies that could degrade longterm device reliability. At a high level this process involves stimulating the input ports with various test patterns also known as test vectors and comparing the output responses against expected results.
Best value professional windows hardware test tool on the market. The proposed techniques are expected to bridge the gap between wafer sort and package test, by providing coste. Edn motorola claims first wafer level burnin and test. The monitoring of device responses while applying suitable test stimuli during wlbi leads to the easier identi. This in turn drives the need for full functional test at probe since traditional package and final test is eliminated from the manufacturing process. Microchips tripletest flow is currently the most robust testing procedure for. Aehr test systems is a worldwide provider of test systems for burnin test equipment and logic, optical and. True, full, tester per pin capabilities to ensure your devices are functioning correctly and not just powered on. Aehr test systems is a worldwide provider of test systems for burn in test equipment and logic, optical and memory integrated circuits worldwide. The physical constraints introduced by multisite wafer level chip scale testing has presented challenges to traditional techniques used for. Distributed test wafer probe, in situ test between key assembly steps and final test slt and ate for 2. Allinone waferlevel solution for mmic automatic testing.
Kes technologies provide solutions for test, burnin, systemlevel test, wafer level burnin and much more. Burn in is a temperaturebias reliability stress test used in detecting and screening out potential early life device failures. Automation of generation of entire test programs for ate. Wafer level burn in and test how is wafer level burn in and test abbreviated. Wafer level burnin system delta v instruments, inc. Wafer level test and burn in wltbi refers to the process of subjecting semiconductor devices to electrical testing and burn in while they are still in wafer form. Us6788094b2 us10326,423 us32642302a us6788094b2 us 6788094 b2 us6788094 b2 us 6788094b2 us 32642302 a us32642302 a us 32642302a us 6788094 b2 us6788094 b2 us 6788094b2 authority. Waferlevel parametric tester targets power sic, gan devices. Wafer level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form.
We refer to this process as waferlevel testduringburnin. For example, the test structure designer has to follow design rules of the fab for the wafer under test. Last but not least, a main challenge is the correlation between the wafer level test and final test. Test scheduling for waferlevel testduringburnin of core. Wafer level burnin and test how is wafer level burnin and test abbreviated. Test scheduling for waferlevel testduringburnin of. Electroglas provides advanced wafer probers, device handlers, test floor management software and services with modern tools for semiconductor industry. Will showcase foxxptm solutions for waferlevel burnin and test of logic, optical and memory. Wafer level burn in and test wlbt is a method for burning in devices while they are still unpackaged. Microchips tripletest flow is currently the most robust testing procedure for serial eeprom. These wafer level burnin systems are being designed around several driving factors. Waferlevel test and burnin wlb waferlevel test and burnin wltbi refers to the process of subjecting semiconductor devices to electrical testing and burnin while they are still in wafer form. The custom photodiode test system is a scalable system that provides a low cost, high performance, accelerated aging, burnin, and qualification testing for photodiodes specifically used in military, telecommunication, and aerospace applications. Moving burnin to the wafer level allows for simplification of package test by eliminating both package burnin and post burnin test, requiring just a single package test insertion with the possible addition of systemlevel tests.
The four papers in this session look at waferlevel test from a number of different perspectives. As of january 2019, astronics test systems has transferred ownership of the astronics systemlevel test product lines to advantest. Waferlevel test and burnin, and semiconductor process. Industry practices and trends overview and defnitions. However, the testing of multiple cores of a soc in parallel during wltbi leads to constantlyvarying device power during the duration of the test. Wafer level burnin and test how is wafer level burnin. Testpattern ordering for waferlevel testduringburnin sudarshan bahukudumbi and krishnendu chakrabarty department of electrical and computer engineering duke university, durham, nc 27708 abstractwaferlevel test during burnin wltbi is a promising technique to reduce test and burnin costs in semiconductor manufacturing. Kes technologies provide solutions for test, burn in, system level test, wafer level burn in and much more. The sti3000 is a waferlevel mems and mixed signal asic probe test system that combines several functional sti test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal asics. The most obvious and immediate advantage of wlr testing is its ability to supply realtime information. Production test of the asic is a key component of what we do and is an important element in the process of providing high quality product that is reliable and free of defects. As the industry moves towards kgd and multichip modules there is an increasing need for burn in systems capable of performing the burn in test function at the wafer level.
Testpattern ordering for waferlevel testduringburnin. Session 6 and, at the wafer level for many in the industry, performing final test at the wafer level is still a novel idea. Waferlevel test during burnin wltbi is an emerging practice in the semiconductor industry that allows testing to be performed simultaneously with burnin at the waferlevel. Waferlevel test and burnin wltbi refers to the process of subjecting semiconductor devices to electrical testing and burnin while they are still in wafer form. Consequently, bist and waferlevel burnin are aimed primarily at reducing the test cost for logic devices. Abstract waferlevel test during burnin wltbi is a promising technique to reduce test and burnin costs in semi conductor manufacturing. Wafer level reliability test solutions greater reliability testing confidence from lab to fab wafer level reliability test solutions keithley instruments has long been an industry leader in both overall parametric test technology and wafer level reliability wlr testing. By this, firm contacts on 2,756 bond pads provided on a 6 diameter wafer are made in a temperature range from room to 125c.
Waferlevel parametric tester targets power sic, gan. Our systems are capable of testing and burningin thousands of photonic devices on wafers in parallel for minutes to. As the industry moves towards kgd and multichip modules there is an increasing need for burnin systems capable of performing the burnin test function at the wafer level. Burnin is a temperaturebias reliability stress test used in detecting and. While providing some much needed solutions, it also comes with its own set of challenges. The advantage of wafer level testing is that these semiconductor devices can. Aehr test systems to introduce next generation foxxp. It is so important and critical to the quality of what we produce that we conduct all wafer probe and ate inhouse at our swindon facility.
These wafer level burn in systems are being designed around several driving factors. Micro burnin techniques at waferlevel test to implement. The harmony wlbi probe card is designed to maximize throughput. Oct 08, 2010 electroglas provides advanced wafer probers, device handlers, test floor management software and services with modern tools for semiconductor industry. Waferlevel testing and test during burnin for integrated. The third level of testing is used to identify manufacturing defects or faults. Tutorial on motorola wafer level burn in and test 2002 southwest test workshop.
Department of electrical and computer engineering duke university, durham, nc 27708. Probe clean is a unique, highly crosslinked, nonconductive, and noncorrosive polymerbased probe cleaning material. Wafer level burnin and test how is wafer level burnin and. June 9, 2002 page 3 direct contact key milestonesqualified process for c4fccbga for powerpc june 2001 product using goremate demonstrated test capability for ncsg dsp march 2002 product and tspg 32bit mcu.
Aehr test fox bi system partial darpa funding nhk spring, yokohama, japan, micropogos electroglas for wafer alignment wafer alignment to the bi pwb is done offline and waferpwb cassettes are held together with air pressure fox equipment provides stimulus and test electronics, thermal management, dut power. Will showcase foxxptm solutions for wafer level burn in and test of logic, optical and memory. Wafer level burnin wlbi and test parallel, dynamic, excitation of all devices on a wafer to screen for marginal devices for infant mortality by dynamically stressing the integrated circuit at elevated temperature and voltage. Burn in is a temperaturebias reliability stress test used in detecting and screening out potential early life failures.
Wafer level stress data successfully used as early burn in predictor. Sti3000 wafer probe test system solidus technologies. Dvi worked with a major semiconductor manufacturer developing a unique wafer level burnin system technology. Only with a good correlation can a comparison of the achieved results be undertaken thus giving the test engineer confidence in his early testing. Nov 07, 2016 learn how the ats 5034 system level test platform tests integrated semiconductors at 5,000 uph to deliver improved yields and the lowest cost of test. A new waferlevel burnin wlbi technology is reported in this paper. A fullyautomated, 48pin parametric test system is designed for waferlevel testing of power semiconductor devices and structures up to 3kv.